Firefly NEXT>
——— LASER SELECTIVE SOLDERING SYSTEMS
After many years of development and several installations worldwide, the Firefly line has completely redesigned its architecture, taking a major step forward and setting the way for the NEXT> generation generation.
The Firefly NEXT> line offers an excellent alternative for the selective soldering process, taking full advantage of laser technology to provide a clean and efficient solution. The modular hardware architecture of the Firefly NEXT> systems, combined with its sophisticated software, enable deployment in different manufacturing environments: multi-product, which require flexibility and fast setup times, or high-volume production, where process control and repeatability are key. Firefly NEXT> introduces a laser beam which is orthogonal to the solder joint, and the donut spot, to improve the focusing of laser energy where required, and offering suitability for very small-sized pads providing clear advantages in terms of applicability and process repeatability. A minimized footprint, efficiency and cleanliness (low maintenance), accompany a flexible, monitorable and certifiable soldering process, making the Firefly NEXT> Selective Soldering System the ideal soldering solution to resolve manufacturing issues, both in EMS (Electronic Manufacturing Services) and OEM industries, such as Automotive.
DIVERSE SOLUTIONS
The soldering head, which is the core of the system, is common to both the Firefly B60 and T60 NEXT> machine configurations. The two solutions are characterized mainly by the side of the board where processing is performed:
the BOTTOM solution, where the soldering process is carried out from below the PCB, and a TOP solution, where the soldering process is carried out from above the printed circuit board. This configuration is particularly suitable for automated processes where the system is integrated into an existing conveyor line.
The Firefly NEXT> soldering systems can be successfully integrated into high-volume production lines, as well as in those cases where the products to be soldered are continuously changing and Lead and Lead-free processes are often mixed.
CUSTOM SOLUTIONS
As a global partner, Seica is able to design and customize specific solutions for its customers also for the sector of laser selective soldering.
VIVA: A GROWING SOFTWARE
The Firefly NEXT> is managed through the VIVA software, common to all Seica systems. By means of its intuitive graphical interface, the software guides the programmer. When CAD data are available, the software can import the coordinates automatically, otherwise, the coordinates of the points to be soldered can be acquired through the camera.
VIVA will automatically generate a soldering program, optimized according to the geometrical and dimensional characteristics of the points to be soldered, allowing to modify the soldering parameters.
MyView
An innovative graphical operator interface is available, specifically designed for manufacturing environments, which allows the customization of the layout of the control buttons and the information displayed on screen, translatable into any language.
PROCESS TRACEABILITY
Process traceability is ensured by the possibility to collect the video recording and thermal profiles acquired for every solder joint, and to associate them to the serial number of the printed circuit board. The collection of this data is also valuable as a debug tool of the soldering process.
INDUSTRY 4.0
The Firefly NEXT> has all of the capabilities needed for implementation in any Factory 4.0 scenario, providing the possibility to plug in any proprietary or third party information system to achieve the desired goals.
ENVIRONMENT-FRIENDLY
With a maximum power absorption of 2.5 KW/h, the Firefly NEXT>SERIES is easy to manage and maintain. In addition, the utilization of flux-based soldering alloys eliminates the need to use external fluxing stations, as well as the necessity for nitrogen. The consumption of solder alloy is limited to the amount applied to each joint, generating zero waste and eliminating disposal costs.
