Elogger™ Strain Measurement System
Printed Wiring Board Strain Testing
Strain testing allows objective analysis of the strain and strain rate levels that a SMT package is subjected to during PWB assembly, test and operation.
The Elogger™ Strain Measurement System is a special design for printed wiring board strain testing application, the real-time data provided by the Elogger system avoids risks such as failures including solder ball cracking, trace damage, pad lifting and substrate cracking during board manufacturing and test processes.
Manufacturing process improvement
• Board depanelization (routing) processes
• All manual handling processes
• All rework and retouch processes
• Connector installation
• Component installation
Shipping Environment:
• Shock and vibration test
• Drop testing test
• Heat sink assembly
• Board support/stiffener assembly
• System board integration or system assembly
Board test processes:
• In-Circuit Test (ICT)
• Board Functional Test or equivalent functional test
APPLICATION:
Automotive
Smart phone and Pad
Laptop
Server
SYSTEM FEATURES & BENEFITS:
• Portable Carrier, compact and lightweight
• Connect to strain gauge and thermocouple directly
• Available for 1200 or 3500 quarter bridge inputs
• High speed sampling rate up to 50K Hz per channe
• Simultaneous sampling with anti-aliasing filter and analog-to-digital conversion for each channel
• PC-Based mainframe provide Hi-Speed USB interface
• Mainframe support various type modules
• Meet hardware requirement of IPC/JEDEC 9704 & 9702
SOFTWARE FEATURES: • User friendly software with One-touch report generation function
• Languages Version selectable includes English, Simplify and Traditional Chinese.
• Data analysis as diagonal strain, Max/Min principal strain, strain rate, Qstrain.
• Easy select analysis function and display in the same page.
• Allow to set up software on different computers.
